Micro Via

Preferred Blind & Buried Micro-Via Design Rules & Technology Roadmap

Symbol	Description	Minimum Current	Dimensions Advanced	(microns) Future
A	Line width-Outer Layer	89	75	50
B	Spacing width-Outer Layer	100	75	62.5
C	Line width-Inner Layer	89	75	50
D	Spacing-Inner Layer	100	75	62.5
E	Microvia-Hole size	100	75	50
F	Microvia-Landing Pad	250	200	100
G	Microvia-Pad	300	250	100
H	Microvia Aspect Ratio(J/E)	=1:1	=1:1	=1:1
I	Drill size-Through hole	200	150	150
J	Pad size-Through hole	450	400	300
K	Buried via-Plated core	200	150	100
L	Buried via-Hole size	200	150	150
M	Buried via-Pad diameter	450	400	300
N	Taper Drilled Blind via-Diameter	400(max) 120(Min)	400(max)  120(Min)	400(max) 120(Min)
O	Taper Drilled Blind via-Depth	400(max) 120(Min)	400(max) 120(Min)	400(max) 120(Min)
P	Straight Drilled Blind via-Diameter	150	100	75
Q	Straight Drilled Blind via-Aspect Ratio	=1:1	=1.2:1	=1.5:1

For further informaiton and technical support please contact:

Andy Roberts andy.roberts@merlincircuit.co.uk
Dennis Price dennis.price@merlincircuit.co.uk