Merlin currently manufacture boards on PTFE, ceramic filled thermoset, Polyimide, BT epoxy and other high frequency materials, as well as the conventional FR4, multifunctional epoxy and FR5 substrates. Our current capabilities extend to 32 layers, 150 micron drill diameter buried/blind vias, 75 micron track and gap on rigid boards.
Flexible circuits are fabricated to 12 layers using Du-pont and Rogers Polyimide base materials. These can be supplied with or without stiffeners. Flexi-rigid circuits are produced to 12 layers (6 rigid + 6 flex).
Higher layer counts can be produced but must be discussed with the Merlin engineering team before order acceptance. Polyester flexible circuits are produced in single sided and double sided plated through hole formats with polyester adhesive flexible cover coats.
We have been selected by a world leading contract electronic manufacturer (CEM) as a strategic working partner to develop circuits, which will accommodate bare silicon devices (flip-chips) directly placed on to the PCB. We have successfully produced flip-chip boards with 150 micron pitch technology and recently manufactured 90 micron pitch test boards with some difficulty. These boards have 50 micron diameter pads and our project is to laser drill and plate a 25 micron micro-via for internal
interconnections. We expect to see this technology in small production quantities within the next two years.
In conjunction with Schloetter, we have perfected the technique of completely filling laser drilled micro-vias with electroplated copper. This process eliminates the industry problems of current carrying capacity and entrapped air after solder paste printing. This can result in a voided or exploded BGA joints during the solder reflow operation. The copper 'slug' is also beneficial in extracting heat from the device and can be tailored to produce plated copper columns as stand-off legs for flip-chip and chip-scale packages.
Our continuing investment programme and strategic partner relationships will ensure
that Merlin remain at the leading edge of world class PCB technology. |
